铜表面BTA薄膜在强酸中耐蚀性的电化学阻抗研究  

AN IMPEDANCE STUDY ON THE INHIBITIVE BEHAVIOR OF BTA FILM ON SURFACE OF Cu iN STRONG ACIDIC SOLUTIONS

作　　者：王月[1] 顾聪[1] 

机构地区：[1]北京科技大学化学系

出　　处：《腐蚀科学与防护技术》1994年第4期311-317,共7页Corrosion Science and Protection Technology

摘　　要：用电化学阻抗法研究铜在强酸中添加ＢＴＡ（苯并三唑）及铜表面预覆ＢＴＡ薄膜后在强酸中的耐蚀行为和机理。研究表明：在强酸溶液中，ＢＴＡ与二价铜离子形成不同配位数的Ｃｕ—ＢＴＡ配合物，在硫酸中抑制阳极反应，在盐酸中抑制阴极反应。在铜表面预覆ＢＴＡ薄膜，对铜有更好的防蚀保护性能。By using electrochemical impendence methods, the corrosion inhibitive behavior and mechanism of benzotriazole(BTA)as an additive in solution or as a protective film on surface for copper electrods in various strong acidic solutions are studied.It has been found that in strong acidic solutions BTA and Cu2+ are combined to form Cu-BTA ligands with various coordination number,which inhibites anode reaction in H2SO4 solution and inhibites cathodic reaction in HCl solution. BTA film prepared on copper surface has more effective corrosion inhibitive characteristic.

关 键 词：铜 电化学阻抗 苯并三唑 涂覆 防腐 薄膜 

分 类 号：TG174.46[金属学及工艺—金属表面处理] TG146.11[金属学及工艺—金属学]