消除产品良率隐藏的杀手——电子束检查是铜逻辑和晶圆代工厂的最佳方法  

Eliminating Buried Yield Killerse-Beam Inspection: Best Practices for Copper Logic and Foundry Fabs

作　　者：David W.Price Todd Henry Robert Fiordalice 

机构地区：[1]KLA-TencorGorp.,Ca.USA,KLA-TencorGorp.,Ca.USA,KLA-TencorGorp.,Ca.USA

出　　处：《电子工业专用设备》2005年第3期38-45,共8页Equipment for Electronic Products Manufacturing

摘　　要：监控和消除隐藏的电路缺陷已成为130nm和130nm以下器件的关键。这使得电子束检查正在广泛应用于开发、试生产和量产的监控过程。我们将描述当前铜逻辑和晶圆代工厂电子束检查技术的执行情况,其中包括详细的案例研究,它说明了从开发到量产过程中应用电子束检查技术的好处。我们也描述了过去克服通用工具障碍的方法。然后,分别介绍了利用电子束检查技术的新进展,以及为假设的20000WSPMφ300mm工厂模拟的最理想执行情况的最佳实例。Monitoring and eliminating buried electrical defects has become critical for 130 nm copper devices and below. As a result, electron-beam inspection is being widely adopted for development, ramp, and volume production monitoring. In this paper we describe current implementation of e-beam inspection technology for copper logic and foundry fabs, including specific case studies which illustrate the benefits of applying e-beam inspection technology from development through volume production. We also describe methods used to overcome common implementation hurdles. We then pair best practices with new advances in e-beam inspection technology to model the optimal implementation for a hypothetical 20 000 WSPM 300 mm fab.

关 键 词：电路缺陷 电子束检查 最佳方法 

分 类 号：TN407[电子电信—微电子学与固体电子学]