生产装配过程中的静电防护  

Electrostatic Discharge Avoidance in Assembly Process

作　　者：倪靖伟[1] 邱颖霞[1] 

机构地区：[1]中国电子科技集团公司第38研究所,安徽合肥230031

出　　处：《电子工艺技术》2005年第2期85-87,91,共4页Electronics Process Technology

摘　　要：随着集成度不断提高,集成电路的内绝缘层愈来愈薄,其互连线与间距愈来愈小,相互击穿电压愈来愈低,静电防护的重要性更加突出。简述了电子产品集成过程中静电防护的实践,在工程中解决了静电接地、静电防护等技术问题。As degree of integration increasing,for integrate circuit,inner insulated layers become thinner,interlinked lines become slenderer and space between becomes smaller.Breakdown voltage is lower and lower.Significance of electrostatic discharge avoidance emerges.Recommend practices on electrostatic discharge avoidance in assembly process and some methods for static electricity grounding,electrostatic discharge avoidance.

关 键 词：静电 接地 静电控制 静电评价 

分 类 号：TN08[电子电信—物理电子学]