低模量、高延伸率有机硅密封材料的研究进展  

The process in study of organosilicone sealants with low modulus and high elongation

作　　者：刘歆洁[1] 胡洪国[1] 陈春荣[1] 林薇薇[1] 郑强[1] 

机构地区：[1]浙江大学高分子科学与工程学系,浙江杭州310027

出　　处：《功能材料》2005年第3期329-331,共3页Journal of Functional Materials

基　　金：国家高技术研究发展计划(863计划)资助项目(2003AA327030);国家杰出青年基金资助项目(50125312)

摘　　要：为适应现代建筑业的特殊工程要求,低模量、高延伸率有机硅密封材料成为近年来研究的热点。本文在简要介绍实现低模量、高延伸率的原理基础上,对其低模量、高延伸率有机硅密封材料的研究现状进行评述并对其发展趋势进行预测。The organosilicone sealants with low modulus, high elongation have become increasingly important due to its desirable properties for modern construction technology. In present paper, several optional approaches including fillers treatment, plasticizer selection, chain-extending and cross-linking control, which can all be utilized to obtain low modulus, high elongation organosilicone sealants, were reviewed with 24 references. The forthcoming developments and concerns were proposed.

关 键 词：低模量 高延伸率有机硅密封材料 有机硅 室温硫化 

分 类 号：O631[理学—高分子化学]