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出 处:《材料工程》2005年第2期6-9,共4页Journal of Materials Engineering
基 金:上海市"火炬计划"项目 (0 3 HJC1 0 80 )
摘 要:模拟分析了SHS-离心法制备陶瓷复合管道在冷却凝固过程中的温度分布和变化,从而为工艺参数的选择和管道界面结构分析提供了基础。利用ANSYS软件的瞬态热分析功能和热-结构耦合功能,数值上模拟复合管道的残余热应力,分析SHS层厚度对陶瓷复合管道性能的影响。数值分析结果表明,合理调整SHS层的厚度,可使界面残余热应力变小,从而提高陶瓷复合管道的安全可靠性。The temperature distribution and variation in the cooling course of the ceramic composite piping prepared by centrifugal-SHS were modeled and analyzed so as to provide the basis of the choice of process parameter and interface structure analysis of the piping. With the function of transient thermal analysis and thermal-structure coupling of ANSYS, the residual thermal stress of the composite piping was numerically simulated and the influence on the performance of the piping with thickness of the SHS layer was studied as well. The results of numerical analysis indicate that modulating the thickness of the SHS layer can reduce the residual thermal stress on the interface, and consequently, the safety reliability of the ceramic composite piping can be enhanced.
关 键 词:SHS-离心法 陶瓷复合管 残余热应力 有限元分析 ANSYS
分 类 号:TB332[一般工业技术—材料科学与工程]
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