陶瓷微细镀覆新技术的研究  

Study on the New Technique of Cu Micro-plating Based on Ceramics

作　　者：辜志俊[1] 赵雄超[1] 郭琦龙[1] 洪艳萍[1] 邓群山[1] 陈人欢[1] 

机构地区：[1]中科院福建物质结构研究所二部,福建厦门361012

出　　处：《电化学》2005年第1期42-45,共4页Journal of Electrochemistry

基　　金：厦门市科技创新基金(3502Z2000401)资助

摘　　要：建立微机处理体系(包括线路、图形设计,光照点选择及活化处理等)与化学镀铜相结合的微细镀覆新技术.该技术可在Al2O3基底上获得性能良好的Cu镀层,其布线速率达 50mm/s,线分辨率 35μm,工艺简便,条件温和,为陶瓷微细镀覆开辟了新途径.By combing the computer processing system (including the design of the line and the pattern, the choice of the scanning area and the treatment of the activation) with the electroless-plating technology, this article provides a new approach for the micro-plating based on the ceramics. The copper film based on ceramics with good properties can be obtained under the mild operating conditions. The line resolution is 35 μm and the wiring speed is 50 mm/s. The results had also showed that the quality of the copper plating is closely related to the roughness of the ceramic substrates.

关 键 词：陶瓷基底 微电子技术 化学镀铜工艺 化学液相沉积 

分 类 号：TN405[电子电信—微电子学与固体电子学]