立体有序的耐高温全苯基有机硅树脂  

High- temperature Resistant Stereo-regular Homo-phenyl Organosilicone Resin

作　　者：陈剑华[1] 于伟泳[1] 邱化玉[1] 王吉顺[1] 

机构地区：[1]山东大学新材料研究所,山东大学实验中心

出　　处：《有机硅材料及应用》1994年第5期8-11,共4页

摘　　要：三氯硅烷的水解物经催化重排，制得了立体有序的全苯基有机硅树脂．以红外和核磁井振表征了其化学组成，以ｘ射线衍射初步分析了其立体有序性，以热重分析法等测定了其耐温世，发现该树脂５５０℃时失重为２．３７９％。６００℃时失重为５．１０５％，在有机硅树脂中尚未见耐温更高的报道。Stereo-regular homo-phenyl organosilicone resin was prepared by means of catalytic rearrangementof hydrolysis product of phenyltrichlorosliane(PhSiCl_3).The chemical composition of the resin was charac-terized by means of IR and 1￣H-NMR. The stereo- regularity was analyzed by means of X- rdy,and theheat- resistant property was determined by means of TGA.It was found the weight loss was 2.379%at550℃and 5.105% at 600℃

关 键 词：耐高温 苯基 有机硅树脂 

分 类 号：TQ324.21[化学工程—合成树脂塑料工业]