基于信号完整性理论的PCB仿真设计与分析研究  

Research on PCB Simulating Design and Analysis Based on Signal Integrity (SI) Theory

作　　者：陈伟[1] 姚天任[1] 黄秋元[2] 王桂琼[2] 

机构地区：[1]华中科技大学电子与信息工程系,武汉430074 [2]武汉理工大学信息工程学院,武汉430070

出　　处：《武汉理工大学学报（交通科学与工程版）》2005年第2期273-276,共4页Journal of Wuhan University of Technology（Transportation Science & Engineering）

基　　金：湖北省科技攻关重大项目;湖北省自然科学基金项目资助 (批准号 :2 0 0 2 AA 10 1A0 4;2 0 0 4A BA0 45 )

摘　　要：在分析高速数字电路设计中存在的几个主要问题的基础上,探讨了高速信号完整性所涉及到的基本理论,研究了在PCB仿真设计实际应用中通常采用的两种模型方法,即IBIS模型和SPICE模型,分析了仿真模型和建模方法.结合一个具体高速电路设计——小型封装可热插拔式光纤收发模块(SFP)的反射仿真实例,讨论了仿真模型的建立并对仿真结果进行了分析,研究结果表明在高速电路设计中采用基于信号完整性的仿真设计是可行的,也是必要的.The theory and application of signal integrity (SI) are key techniques to be solved in the design of high-speed digital circuit. In this paper, the basic theory related in high-speed signal integrity is discussed at first on the basis of analyzing the dominate problems existed in high-speed signal, which includes electromagnetic theory, transmission line theory, as well as signal integrity theory. Then, two model techniques, i.e., IBIS and SPICE, are investigated on practical application to the PCB simulating design. At last, combining with a real high-speed system design-reflecting instance of small form-factor pluggable optical transceiver (SFP), a complete design example is discussed and analyzed in detail for the setting up of the simulating model. Conclusion shows that it is not only feasible in the design of high-speed system adopted simulating technique based on signal integrity, but also necessary in actual applications.

关 键 词：信号完整性 仿真设计 PCB 高速数字电路设计 高速电路设计 SPICE模型 IBIS模型 光纤收发模块 仿真模型 模型方法 建模方法 仿真结果 研究结果 插拔式 封装 

分 类 号：TN41[电子电信—微电子学与固体电子学] TP368.5[自动化与计算机技术—计算机系统结构]