激光打孔  

出　　处：《金属加工工艺与设备：英文版》2005年第2期24-26,共3页

摘　　要：Effects of inter-pulse and intra-pulse shaping during laser percussion drilling;Endpoint detectable plating through femto-laser drilled glass wafers for three-dimentional electric interconnections;HIGH ASPECT-RATIO LASER-DRILLING OF MICRO-HOLES WITH A ND:YAG MASTEROSCILLATOR POWER-AMPLIFIER (MOPA) SYSTEM;High Speed Videography of Microvia Formation and Melt

关 键 词：激光打孔 形状控制 温度条件 钇铝石榴石激光器 

分 类 号：TG52[金属学及工艺—金属切削加工及机床] TN248.13[电子电信—物理电子学]