MLCC制造中产生内部开裂的研究  

Study on the Inner Crack of MLCC which is Caused in MLCC Manufacturing Process

作　　者：张尹 赖永雄 肖培义 李基森 

机构地区：[1]广东风华高新科技股份有限公司,广东肇庆526020

出　　处：《电子元件与材料》2005年第5期52-54,共3页Electronic Components And Materials

基　　金：国家"十五"及"863"计划资助项目(2001AA32G030)

摘　　要：从内电极设计、内浆(内电极浆料)的选择、内电极干燥工艺等方面对MLCC内部开裂的原因进行了深入研究,结果表明,通过测试瓷膜与内浆的热收缩曲线,选择收缩率相接近的瓷膜与内浆来制作MLCC;调试选用合适的内电极干燥温度、时间;改变内电极设计,在产品中间层加一个厚度2～5倍于其它介质厚度的不错位夹层,MLCC内部开裂几率由原来的5.1%下降到目前的0.38%。The issue which could cause inner crack was studied in the article from paste selecting, electrode drying and electrode designing. The results show that MLCC inner crack can be prevented though making the thermal shrinkage curves of ceramic tape and paste as close as possible, controlling the electrode dryness after screening, adding a no offset interlayer whose dielectric thickness is 2～5 times more than others .After using these measures, MLCC inner crack decreases obviously from 5.1% to 0.38%.

关 键 词：电子技术 MLCC 内部开裂 内电极浆料 设计 

分 类 号：TM534.1[电气工程—电器]