瞬时液相扩散连接的双温工艺模型  

Transient liquid phase diffusion bonding with two-step heating process

作　　者：陈思杰[1] 井晓天[1] 李辛庚[2] 

机构地区：[1]西安理工大学材料科学与工程学院 [2]山东电力研究院,济南250002

出　　处：《焊接学报》2005年第4期69-72,共4页Transactions of The China Welding Institution

摘　　要：在开发T91钢管瞬时液相扩散连接工艺的过程中,提出了一种新的TLP连接工艺模型,在等温凝固前先进行短时高温加热,然后再降低到连接温度进行等温凝固,等温凝固温度低于传统工艺的温度。研究表明,新工艺连接的组织和性能都优于传统的工艺,得到了无焊缝的理想组织。新工艺温度参数:1270℃加热0.5min,1230℃保温3min,传统工艺温度参数:1250℃保温3min。This paper describes a novel transient liquid phase (TLP) diffusion bonding model recently developed for bonding T91 steel pipes. The method is based on imposing a short-time high heating temperature before the isothermal solidification of the liquid layer. The method reliably produces bond whose tensile strengths as high as those of the parent material. Consequently, bonding strength is increased possibly due to the higher metal-to-metal contact along the non-planar bond lines as compared to the planar bond lines associated with conventional TLP diffusion bonding. The testing results showed that the solidified bond should consist of a primary solid solution with a composition similar to that of the parent metal and free from precipitates. Bonding parameter of new process is 1270°C for 0.5 min and 1230°C for 3 min. Conventional bonding parameter is 1250°C for 3 min.

关 键 词：T91钢 瞬时液相扩散连接 中间层 显微组织 模型 双温工艺 

分 类 号：TG457.11[金属学及工艺—焊接]