脉冲电流密度对电沉积纳米晶镍织构和硬度的影响  

Effect of Pulse Current Density on the texture and Hardness of Electrodeposited Nanocrystalline Nickel

作　　者：王立平[1] 肖少华[1] 高燕[1] 刘惠文[1] 徐洮[1] 

机构地区：[1]中国科学院兰州化学物理研究所固体润滑国家重点实验室,甘肃兰州730000

出　　处：《电镀与精饰》2005年第3期40-42,共3页Plating & Finishing

摘　　要：采用脉冲电沉积法制备了韧性较好的纳米晶镍镀层。考察了脉冲峰值电流密度对纳米晶镍镀层织构和硬度的影响。结果表明,随着脉冲峰值电流密度的增加,Ni(111)晶面择优取向程度逐渐增强,晶粒显著减小,镀层的硬度逐渐增加。纳米晶镍镀层硬度与晶粒尺寸的关系符合经典的Hall-Petch效应。Nanocrystalline Ni deposits with better ductility were produced by pulse electrodeposition method. The effects of pulse peak current density on the texture and hardness of electrodeposited Ni were investigated. Results show that (111) growth orientation was increased and the grain size of nanocrystalline Ni was decreased gradually with the increase in pulse peak current density, which results in the gradual increase in hardness of Ni deposits. Moreover, the relation between hardness and grain size of nickel is in good agreement with Hall-Petch hardening effect.

关 键 词：电流密度 纳米晶镍 织构 晶面择优取向 脉冲峰值 电沉积法 晶粒尺寸 镀层硬度 镍镀层 

分 类 号：TQ153.2[化学工程—电化学工业] TQ153.12