纳米孪晶纯铜的强度和导电性  

Ultrahigh strength and high electrical conductivity of copper with nanometer sized twins

作　　者：申勇峰[1] 卢磊[1] 陈先华[1] 钱立华[1] 卢柯[1] 

机构地区：[1]中国科学院金属研究所沈阳材料科学国家实验室,沈阳110016

出　　处：《物理》2005年第5期344-347,共4页Physics

基　　金：国家自然科学基金(批准号:50021101;50201017;90206044);国家重点基础研究发展计划(批准号:G1999064505);德国马普金属研究所资助项目

摘　　要：强度和导电性是金属材料的两个至关重要的性能.常用的金属材料强化方式往往是在提高强度的同时使材料的导电性能明显损失.文章介绍了采用脉冲电解沉积技术制备出具有高密度孪晶片层结构的纯铜薄膜.这种具有纳米尺度的孪晶片层结构的纯铜材料不仅具有非常高的拉伸强度,同时还具有非常高的导电性.拉伸实验表明,当孪晶片层平均厚度小到15nm时,样品的拉伸屈服强度可达900MPa,断裂强度高达1068MPa(约为普通纯铜的10倍以上),并具有与无氧高导铜相当(97%IACS)的室温电导率.One of the critical problems in metallic materials is how to enhance their strength while keeping their conductivity. The prevalent strengthening methods employed usually lead to a pronounced decrease in conductivity. In this study, high-purity Cu foil samples with high density nanometer sized twins were synthesized by means of a pulsed electro-deposition technique. For Cu samples with an average twin lamellar thickness of 15 nm, the tensile yield strength could be as high as 900 MPa, and the ultimate tensile strength was 1068 Mpa, which is about 10 times higher than that of coarse grained Cu. The most interesting phenomenon is that this sample also retains a very high conductivity comparable to that of pure Cu.

关 键 词：纳米孪晶纯铜 脉冲电解沉积技术 拉伸屈服强度 金属材料 室温电导率 导电性能 强化方式 拉伸强度 纯铜材料 纳米尺度 纯铜薄膜 拉伸实验 断裂强度 层结构 高密度 晶片 

分 类 号：TB383[一般工业技术—材料科学与工程]