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机构地区:[1]昆明贵金属研究所第二研究室,昆明650221
出 处:《中国有色金属学报》2005年第4期506-512,共7页The Chinese Journal of Nonferrous Metals
基 金:国家自然科学基金资助项目(50371030)
摘 要:制备了Cu 10Ag和Cu 10Ag 0 05Ce合金, 其铸态结构由Ag沉淀、(Cu+Ag)共晶和Cu基体组成。采用大变形法制备了两合金的原位纳米纤维复合材料。研究了大变形(真应变ε≥9)合金和时效态合金的结构与性能, 观察了Ag沉淀过程。结果表明微量Ce添加剂细化Ag纤维尺寸, 提高再结晶温度和不连续沉淀的温度, 明显提高形变态、时效态和完全退火态Cu 10Ag合金的拉伸强度, 而保持与Cu 10Ag合金相近或相当的导电率。真实应变ε=9 9的大变形Cu 10Ag和Cu 10Ag 0 05Ce合金的抗拉强度分别为1 190 和1 430 MPa, 导电率分别为68 7%和67 6%IACS, 这些性能在低于300℃是稳定的。The Cu-10Ag and Cu-10Ag-0.05Ce alloys were prepared. The microstructures of the cast alloys consist of Ag precipitate, (Cu+Ag) eutectic and Cu matrix. The Cu-10Ag and Cu-10Ag-0.05Ce alloys in situ nano-filamentary composites were also prepared by the heavy deformation. The structure and properties of the alloys heavy deformed with the true strain ε≥9 and aged at different temperatures were studied. The results indicate that the Cu-10Ag-0.05Ce alloy possesses much higher tensile strength and recrystallization temperature than Cu-10Ag alloy, with similar electrical conductivity to that of the Cu-10Ag alloy. The tensile strength and the electrical conductivity of the heavy deformed Cu-10Ag and Cu-10Ag-0.05Ce alloys with true strain ε=9.9 are 1190 and 1430MPa, and 68.7% and 67.6%IACS, respectively. The properties are increased to a certain extent in the aging process at temperatures below 300℃ for both Cu-10Ag and Cu-10Ag-0.05Ce alloys.
关 键 词:原位复合材料 Cu—Ag合金 CE 沉淀 拉伸强度 导电率
分 类 号:TG146.1[一般工业技术—材料科学与工程] TG146.3[金属学及工艺—金属材料]
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