硬质合金与碳钢电子束对接焊接头的显微组织  

Microstructure of Electron Beam Weld Joints between Cemented Carbide YG30 and Carbon Steel

作　　者：赵秀娟[1] 杨德新[1] 王浩[1] 高泽幸治 山森英明 田头孝介[3] 

机构地区：[1]大连铁道学院材料科学与工程系,辽宁大连116028 [2]日本苫小牧工业高等专门学校 [3]日本室兰工业大学

出　　处：《机械工程材料》2005年第5期21-23,26,共4页Materials For Mechanical Engineering

摘　　要：选用YG30硬质合金与45钢进行电子束对接焊复合试验,用扫描电镜、波长分散X射线谱仪对焊接接头显微组织进行了分析。结果表明:当电子束电流小、焊接速度慢时,焊接接头易形成有害的η相,η相分布于YG30/焊缝界面区域,并聚集长大,η相层厚度约10μm;焊接过程中硬质合金脱碳和铁向硬质合金迁移是η相形成的主要原因。The electron beam welding of cemented carbide YG30 and carbon steel 45 was carried out. The scanning electron microscope (SEM) equipped with wavelength-dispersive X-ray spectrometer was used to analyze the microstructure of weld joints. The results showed that detrimental eta phases were formed easily when the beam current was small and the welding speed was low. The eta phases appeared, accumulated, and gew at the zones near the boundaries of YG30 and welding. The thickness of eta phase layer was about 10 micrometers. The main reason of eta phase formation was that the carbon and iron diffused from the cemented carbide and the weld respectively during welding.

关 键 词：电子束焊 硬质合金 焊接接头 显微组织 

分 类 号：TG456.3[金属学及工艺—焊接]