热固性聚酰亚胺基体树脂的流变行为  

Rheological Behavior of Thermosetting Polyimide Resins

作　　者：王震[1] 李青璇[1] 高连勋[1] 丁孟贤[1] 益小苏[2] 

机构地区：[1]中国科学院长春应用化学研究所高分子物理与化学国家重点实验室,长春130022 [2]北京航空材料研究院先进复合材料国防科技重点实验室

出　　处：《应用化学》2005年第5期548-550,共3页Chinese Journal of Applied Chemistry

基　　金：国家自然科学基金(50333030);国家"九七三"计划(G2003CB615604)资助项目

摘　　要：PMR(Polymerization of Monomer Reactants)型聚酰亚胺树脂(PI)以其优异的耐热氧化性能、机械性能、介电性能、良好的耐溶剂性能以及高的玻璃化转变温度,在航空、航天等领域得到了广泛的应用,并已成为目前使用最广泛的聚酰亚胺复合材料的基体树脂[1～3].Seven thermosetting polyimides(PI) were synthesized via the reactions of oxydiphthalic (anhydride), thioetherdiphthalic anhydride and active end cap. It was found that the lowest viscosities of the two PI (resins) end-capped with NA were both under 10 Pa·s, while the lowest viscosities of the PI resins end-capped with phenylethynyl were all around 1~2 Pa·s, and the cure temperature increased to 350 ℃, which basically meets the requirments of the RTM technology.

关 键 词：聚酰亚胺 二苯醚二酐 二苯硫醚二酐 苯乙炔苯酐 流变 

分 类 号：O631.2[理学—高分子化学]