铜碲合金时效工艺的研究  

Study on the Aging Process of Cu-Te Alloys

作　　者：朱达川[1] 宋明昭[1] 涂铭旌[1] 

机构地区：[1]四川大学,四川成都610065

出　　处：《稀有金属材料与工程》2005年第5期807-810,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金青年基金资助(50201010);教育部博士点基金资助(20010610013)

摘　　要：研究了铜碲合金的时效工艺,用扫描电镜(SEM)和能谱(EDS)分析了析出相的形貌与组成,进而研究了时效工艺对其电性能及力学性能的影响。研究表明:时效过程中Te以第二相形式析出(Cu2Te);随时效温度的升高、时效时间的延长,时效态的铜碲合金位错密度降低,晶粒长大,第二相析出充分,因而电阻率单调下降;但由于时效析出与再结晶的交互作用,其抗拉强度出现波动,存在1个峰值;综合性能以420℃下时效6h较好。The effects of aging process on the electrical and mechanical properties are studied. SEM and EDS were used to analysize the mophologies and composition of precipitations. The results show that Te precipitated as Cu2Te during aging process of Cu-Te alloys. The density of dislocation of aging Cu-Te alloys decreases, grain size increases and more second phase precipitates when the aging temperature is higher and the aging time is longer. Because of interaction between aging precipitation and recrystallization, the electrical resistance dropped and tensile strength fluctuates. There is a peak at tensile strength curve. The Cu-Te alloys aging for 6 hours at 420 degrees C have the best comprehensive properties.

关 键 词：铜碲合金 时效工艺 再结晶 

分 类 号：TG156.92[金属学及工艺—热处理]