Effect of Cu additions on interdiffusion behavior in the Al-Zn solid solution  

作　　者：任玉平 郝士明 

机构地区：[1]东北大学

出　　处：《材料与冶金学报》2005年第2期163-166,共4页Journal of Materials and Metallurgy

基　　金：国家自然科学基金资助项目(No.50171019).

摘　　要：After diffusion couples were annealed at 260-360 ℃, the concentration profiles of Zn element were measured by EPMA. It has been first quantitatively determined by Matano method that the interdiffusion coefficient in A1-Zn fee solid solution containing high Zn contents is remarkably decreased due to the small addition of Cu. Also, the interdiffusion coefficient in A1-Zn fee solid solution clearly increases with the increasing of Zn concentration. The interdiffusion activity energy remarkably decreases with the increasing of Zn contents. On the other hand, the interdiffusion activity energy markedly increases due to the small addition of Cu in the A1 Zn fcc solid solution containing high Zn contents.After diffusion couples were annealed at 260~360 ℃, the concentration profiles of Zn element were measured by EPMA. It has been first quantitatively determined by Matano method that the interdiffusion coefficient in Al-Zn fcc solid solution containing high Zn contents is remarkably decreased due to the small addition of Cu. Also, the interdiffusion coefficient in Al-Zn fcc solid solution clearly increases with the increasing of Zn concentration. The interdiffusion activity energy remarkably decreases with the increasing of Zn contents. On the other hand, the interdiffusion activity energy markedly increases due to the small addition of Cu in the Al-Zn fcc solid solution containing high Zn contents.

关 键 词：CU A1-Zn固溶体 扩散行为 活化能 

分 类 号：TG111.6[金属学及工艺—物理冶金]