超声波化学镀Ni-Cu-P合金  

Electroless deposition of Ni-Cu-P alloy enhanced by ultrasonic wave

作　　者：钟惠妹[1] 黄振霞[1] 许彩霞[1] 陈震[1] 

机构地区：[1]福建师范大学化学与材料学院,福建福州350007

出　　处：《电镀与涂饰》2005年第6期8-11,共4页Electroplating & Finishing

基　　金：福建省发改委重点项目(04SHDX132);福建省教育厅资助项目(04K026)

摘　　要：　在有机高分子聚合物薄膜,如投影仪专用胶片上超声波化学镀Ni Cu P合金,研究了镀液各组分浓度、pH值变化对沉积速度的影响。通过扫描电镜(SEM)观测镀层的表面形态及厚度,并用其所附带的能谱(EDS)分析镀层成分,采用透射电镜(TEM)观测镀层中粒子的微观形貌及大小,利用X 射线衍射(XRD)表征镀层的微观结构。结果表明,Ni Cu P合金化学镀层为非晶态合金,光亮、均匀,与基体结合面平整。镀层厚度100μm,镀层颗粒大小在30～40nm,各成分含量分别为77 73%～90 64%Ni,0 38%～5 27%Cu,7 23%～14 30%P。<Abstrcat> Electroless deposition of Ni-Cu-P alloy with ultrasonic equipment on the organic polymer membrane, such as transparency film for projecter, were carried out. The influences of change of each component's concentration and pH value on deposition rate were discussed. The surface morphology and thickness of the deposit were examined by SEM, and composition of the deposit was analysed by EDS. The micrograph of the particles in deposit and their size were observed by TEM. The microstructure of the deposit was characterized by XRD. Results showed that electroless Ni-Cu-P alloy deposit is amorphous, bright, uniform and adhesive to substrate. The thickness of the alloy deposit is 100 μm and size of the particles in deposit is 30～40 nm. The deposit is composed of 77.73%～90.64%Ni,0.38%～5.27%Cu and 7.23%～14.30%P.

关 键 词：超声波 化学镀 Ni—Cu—P舍金镀层 沉积速度 

分 类 号：TQ153[化学工程—电化学工业] O646.54[理学—物理化学]