低温快速化学镀镍工艺的研究  

A Research on Low Temperature and High Speed Electroless Nickel Plating

作　　者：张丕俭[1] 刘艳红[1] 夏振展[1] 

机构地区：[1]烟台师范学院化学与材料科学学院,山东烟台264025

出　　处：《电镀与环保》2005年第2期24-26,共3页Electroplating & Pollution Control

摘　　要：在弱酸性化学镀镍溶液中加入一种添加剂 ,在 30～ 95°C范围内都可获得镍磷合金镀层 ,沉积速率最高可达 30 μm h ,同时测试了温度、pH值及镀液成份对沉积速率的影响 ,并讨论了镀液的稳定性及添加剂的作用。When a special additive is put into weak acidic electroless Ni plating bath,Ni-P alloy coating can be obtained within a wide temperature range of 30 - 95 ℃ with a depositing rate up to 30 μm/h.The effects of temperature,pH and ba t h ingredients on depositing rate are tested ,and the stability of the bath and t he role of the additive are also discussed.

关 键 词：化学镀镍工艺 低温快速 化学镀镍溶液 镍磷合金镀层 沉积速率 添加剂 弱酸性 pH值 稳定性 镀液 

分 类 号：TQ153.12[化学工程—电化学工业] TQ639.2