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机构地区:[1]上海交通大学金属基复合材料国家重点实验室,上海200030
出 处:《物理化学学报》2005年第6期681-685,共5页Acta Physico-Chimica Sinica
基 金:上海市纳米科技专项资助基金(0352nm081)资助项目~~
摘 要:用等温差示扫描量热法(DSC)研究了酸酐固化环氧树脂/蒙脱土复合材料的等温固化过程,考察了未处理的蒙脱土(MMT)和有机蒙脱土(OMMT)对环氧树脂固化动力学的影响.实验表明,环氧树脂的固化过程包含自催化机理,加入蒙脱土没有改变固化反应机理.用Kamal方程对该体系的固化过程进行拟合,得到反应级数m、n,反应速率常数k1、k2,总反应级数(m+n)在2.4 ̄3.0之间.MMT的加入使环氧树脂体系的k1、k2有所降低,而OMMT的加入对体系的k1、k2影响较为复杂,加入蒙脱土对环氧树脂固化体系的活化能影响较小.The isothermal cure kinetics of the epoxy resin (EP)/montmorillionite composites, with anhydride as curing agent, was studied by means of differential scanning calorimetry (DSC), and the effects of original montmorillionite (MMT) and organic montmorillion (OMMT) on cure kinetics of epoxy resin were investigated. Analysis of DSC data indicated that curing process of the epoxy resin contains autocatalytic mechanism, the addition of the montmorillionite to the epoxy resin does not change the cure reaction mechanism. The curing process of the EP/montmorillionite composites was simulated by Kamal equation. Two reaction orders, m and n, and two rate constants, k(1) and k(2) were obtained. The overall reaction order, m + n, is in the range 2.4 similar to 3.0. The addition of the MMT to the epoxy resin decreases rate constants k(1) and k(2), but the OMMT makes rate constants k(1) and k(2) complicated. The cure activation energy of the epoxy resin varies slightly by the addition of montmorillionite.
分 类 号:TB332[一般工业技术—材料科学与工程]
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