模压工艺对7075/SiC_p复合材料组织和性能的影响  

Effect of Die Forming Technologies on Microstructure and Properties of 7075/SiC_p

作　　者：袁武华[1] 杨寿智[1] 刘兴[1] 闫小宁[1] 张晨晨[1] 李英芝[1] 

机构地区：[1]湖南大学材料科学与工程学院金属材料研究所,湖南长沙410082

出　　处：《材料开发与应用》2005年第3期22-24,46,共4页Development and Application of Materials

摘　　要：研究了喷射沉积7075/SiCp复合材料坯经过模压后的组织和性能。模压温度对沉积坯增强颗粒分布、基体组织、坯料密度以及压坯的硬度等影响明显。随着温度的提高,沉积坯中的SiC层状分布得到消除,但在600℃时压坯中的晶粒长大和SiC颗粒晶界偏聚较明显。温度提高,压坯上下密度和硬度差减小,600℃以上密度趋于一致,但硬度降低明显。在560～600℃模压,对材料致密化、组织和性能优化较为有利。<Abstrcat> The microstructure and properties of die-formed 7075/SiC_p composites prepared by spray deposition were studied. The SiC distribution, microstructure of matrix alloy, densities and hardness of the compacts were depended on the pressing temperature. The SiC layers in deposite were eliminated,the differences of densities and hardness between the top and bottom of the compacts were lessened as the pressing temperatures rise, and as the temperature rise above 600℃, the hardness decreased markedly. The results show that the optimizing pressing temperature lies between 560℃ and 600℃.

关 键 词：铝基复合材料 模压成形 喷射沉积 

分 类 号：TG333[金属学及工艺—金属压力加工]