铜铁界面含氧层对镀层结合强度的影响  

Effect of Oxidation Layer at the Coating-Iron Substrate Interface on Bonding Strength of Electroplated Copper Coating

作　　者：冯绍彬[1] 商士波[1] 冯丽婷[1] 包祥[1] 张经纬[2] 李宗慧[2] 

机构地区：[1]郑州轻工业学院材料与化学工程学院,河南郑州450002 [2]河南大学特种功能材料重点实验室,河南开封475001

出　　处：《材料保护》2005年第6期4-6,共3页Materials Protection

基　　金：国家自然科学基金项目(20376077)

摘　　要：镀层与基体界面间含氧层的存在,影响电镀层与基体之间金属键的形成,进而影响镀层的结合强度。用氰化物和焦磷酸盐两种工艺在铁片上镀铜,对镀层进行恒电流极化,并以氩离子深度刻蚀和X射线光电子能谱相结合的方法进行检测。电沉积初始电位时间曲线显示,两种镀铜工艺,结合强度好的出现了基体表面的还原活化电位平阶,结合强度差的焦酸盐镀铜未出现活化就发生了金属的电沉积,而且铜镀层与基体界面含氧量有增高的现象。铜镀层与铁基底界面间含氧层的存在是影响镀层结合强度的主要原因。通过控制金属电沉积初始电位可提高镀层的结合强度。The oxidation layer at the coating-substrate interface affects the formation of metallic bonds between the layer and the substrate and hence influences the bonding strength of the coating to the substrate. Thus copper coatings were electrodeposited on iron substrate from a cyanide copper plating bath and a pyrophosphate copper plating bath, respectively, using polarization at constant current. The potential-time curves were analyzed, while the elemental depth profiles of the coatings were determined using X-ray photoelectron spectroscopy coupled with Ar ion sputtering. The results showed that a flat step appeared on the potential-time curve at the initial stage electrodeposition (reduction and activation stage of the substrate surface) of the copper coating in the cyanide bath, and the copper coating in this case had good bonding strength to the iron substrate. Contrary to the above, copper electrodeposition happened prior to the activation of the substrate in the electroplating of the copper coating from the pyrophosphate bath, and the coating in this case had poor bonding strength to the substrate, while the oxygen content at the coating-substrate interface tended to increase. Moreover, the oxidation layer at the coating-substrate interface had a significant effect on the bonding strength of the copper coating to the iron substrate, and it was feasible to increase the bonding strength of the coating by properly adjusting the initial electrodeposition potential.

关 键 词：镀铜 镀层 结合强度 氧化层 

分 类 号：TQ153.2[化学工程—电化学工业]