Cu层宽度对弯曲型三明治结构FeCuNbCrSiB/Cu/FeCuNbCrSiB多层膜应力阻抗效应的影响  

Stress-impedance Effect in Sandwich FeCuNbCrSiB/Cu/ FeCuNbCrSiB Films with a Meander line Structure

作　　者：陈吉安[1] 张亚民[1] 赵晓昱[2] 周勇[1] 周志敏[1] 王明军[1] 高孝裕[1] 

机构地区：[1]上海交通大学微纳米科学技术研究院 [2]上海工程技术大学汽车工程学院,上海200336

出　　处：《金属功能材料》2005年第3期9-12,共4页Metallic Functional Materials

基　　金：国家自然科学基金项目(50275096);上海市纳米专项(0215nm104;0352nm014)。

摘　　要：基于MEMS微细加工工艺,利用磁控溅射方法在Si基片上制备了不同Cu层宽度弯曲型三明治结构的FeCuNbCrSiB/Cu/FeCuNbCrSiB多层膜,在频率1～40MHz下研究了Cu层宽度对多层膜的应力阻抗效应的影响。结果表明,弯曲型三明治结构多层膜的应力阻抗(SJ)效应随Cu层宽度的变化有明显的变化,在频率5MHz、基片自由端在y轴方向偏移的距离h为1500μm时,当Cu层宽度为0.4mm时,应力阻抗效应达-25%左右。Sandwich FeCuNbCrSiB/Cu/FeCuNbCrSiB films of different Cu width with a meander line structure were prepared on silicon substrate by magnetron sputtering and MEMS microfabrication technology. Dependence of Stress-impedance (SI) effects were studied on Cu width in the frequency range of 1MHz～40MHz.Experimental results show that the SI effect is stronger in the sandwich FeCuNbCrSiB/Cu/FeCuNbCrSiB films with a meander line structure in different Cu width, and the maximum SI effect with a value of -25% or so is obtained at 0.4mm Cu width while h reaches 1500μm for a frequency of 5MHz.

关 键 词：应力阻抗 FeCuNbCrSiB/Cu/FeCuNbCrSiB 三明治薄膜 弯曲型结构 微细加工 

分 类 号：TH703[机械工程—仪器科学与技术]