焦磷酸盐电镀铜初始过程研究  

Initial Process of Pyrophosphate Copper Electroplating

作　　者：冯绍彬[1] 商士波[1] 冯丽婷[1] 

机构地区：[1]郑州轻工业学院材料与化学工程学院,河南郑州450002

出　　处：《电化学》2005年第2期228-231,共4页Journal of Electrochemistry

基　　金：国家自然科学基金(20376077)资助

摘　　要：应用恒电流法研究了铁基体上焦磷酸盐电镀铜电位时间变化类型与镀层结合强度之间的关系.提出了临界起始电流密度(DKC)概念.当起始工作电流DKI大于DKC时,铁电极首先被极化至铁表面的活化电位,即基体表面被活化,随后极化至铜的析出电位,使铜层沉积在活化的铁基体表面上,形成具有良好结合强度的铜镀层.反之,如DKI小于DKC,则铜层只能在"钝化"的含氧层表面上析出,得到的镀层结合强度很差.由氩离子溅射深度刻蚀和X射线光电子能谱(XPS)检测出结合强度差的镀层和基体间界面含氧层的存在.调整工艺条件,优化了焦磷酸盐直接镀铜工艺,可降低工艺的DKC,得到与铁基体具有良好结合强度的电镀层.The relationship between the type of on changes of copper electroplating potential^time and the adhesion of coating layer was examined by chronopotentiometry. The conception of critical initial current density (D_(KC)) was put forward. When the initial working current (D_(KI)) was higher than the critical initial current, the iron electrodewas polarized to activation potential of iron surface firstly, then to the activation of the substratesurface, and finally to depositionpotentialof copper ion. The coating deposited on the active surface and had goodadhesion.On the contrary,when D_(KI) was lower than D_(KC), the coating deposits on the surface of 'passivated' iron substrate, and bad coating was only gained. The combinationof Ar ion sputtering and X radial photoelectron spectra may measure the existence ofoxygen layerbetween copper coating and iron substrate. Through adjusting technical condition, the optimal process of pyrophosphatedirection copper plating was given.

关 键 词：焦磷酸盐镀铜 临界起始电流密度 结合强度 XPS 深度刻蚀 

分 类 号：TQ153.14[化学工程—电化学工业]