巯基乙酸自组装膜修饰金电极的制备与电化学表征  

Construction and Electrochemical Behaviours of Mercaptoacetic Acid Self-assembled Modified Gold Electrode

作　　者：孙伟[1] 尚智美[1] 胡轩[1] 焦奎[1] 崔爱龙[2] 

机构地区：[1]青岛科技大学化学与分子工程学院,山东青岛266042 [2]胜利油田胜采一矿工程技术管理站,山东东营257051

出　　处：《青岛科技大学学报（自然科学版）》2005年第3期189-192,共4页Journal of Qingdao University of Science and Technology:Natural Science Edition

基　　金：国家自然科学基金项目(20405008);青岛市自然科学基金项目(042JZ114)

摘　　要：利用自组装技术将巯基乙酸固定在金电极表面形成巯基乙酸自组装膜修饰金电极,并利用循环伏安法初步研究了该自组装单分子膜修饰电极的电化学行为。结果表明,巯基乙酸在金电极表面具有特性吸附,形成具有一定致密性的吸附层,使电极的双电层电容降低。以[Fe(CN)6]3-/4-氧化还原电对为探针考察了巯基乙酸自组装膜修饰金电极的电化学性质,巯基乙酸自组装膜的存在对[Fe(CN)6]3-/4-的电子转移起了明显的阻碍作用。A self-assembled modified gold electrode was obtained by modifying with mercaptoacetic acid, based on the strong interaction of -SH with gold surface. The electrochemical behaviors of the self-assembled monolayer (SAM) electrode were preliminarily studied by cyclic voltammetric technique. The results showed that a self-assembled monolayer (SAM) was formed on the surface of gold electrode. \[Fe(CN) 6\] 3-/4-redox couple was used as the electrochemical probe to study the electrochemical characteristics of the self-assembled modified gold electrode and the results showed that the existence of mercaptoacetic acid membrance on gold surface hindered the electron transfer.

关 键 词：巯基乙酸 自组装膜 金电极 电化学 [Fe(CN)6]^3-/4- 

分 类 号：O657[理学—分析化学]