激光切割金属厚板新技术  

Newly developed technique of laser cutting thick metal plates

作　　者：谢小柱[1] 李力钧[1] 张屹[1] 刘继常[1] 鄢锉[1] 

机构地区：[1]湖南大学激光研究所,长沙410082

出　　处：《激光技术》2005年第3期251-254,共4页Laser Technology

摘　　要：介绍了激光切割金属厚板的过程,分析了存在的主要问题及产生的原因,最后从激光器、聚焦光学系统以及辅助气流的改进等方面介绍了一些激光切割厚板的新技术,为进一步的研究和工业化应用提供了技术参考。The process of laser cutting thick metal plates was in troduced.The main problems and their causes were analyzed.A series of newly deve loped thick cutting methods were ultimately recommended with respect to improvem ents on lasers,focusing system and assisted gas jet,which provides the technique references for further research and industrial application.

关 键 词：激光切割 金属厚板 影响因子 发展趋势 

分 类 号：TG485[金属学及工艺—焊接]