Simulation and analysis of effects of Young’s modulus of isolation material on natural frequencies of the sensor package and displacement of the chip  

作　　者：殷景华 吕光军 刘晓为 雷清泉 

机构地区：[1]Dept. of Electronic Science and Technology, Harbin University of Science and Technology, Harbin 150080,China [2]MEMS Center, Harbin Institute of Technology, Harbin 150001,China

出　　处：《Journal of Harbin Institute of Technology(New Series)》2005年第3期295-299,共5页哈尔滨工业大学学报（英文版）

基　　金：Sponsored by the Creativity Ability Fund Project for Cadreman of General Provincial University of Heilongjiang(Grant No.1053G033).

摘　　要：For the first time an anti-shock packaging model of an acoustic-vibration sensor system has been designed by using the shocking isolation principle. The finite element analysis has been applied for design and simulation of the model. The effects of Young’s modulus of anti-shock rubber on naturally occurring frequencies of the combination of rubber and an acoustic sensor chip were analyzed. The displacement of the acoustic sensor chip is loaded with force. The results of static analysis and harmonic analysis show that while increasing Young’s modulus of anti-chock rubber, the first five natural frequencies of the package body also increases. Yet the displacement of the acoustic sensor chip around the resonant frequency decreases. The results of static and transient analysis show that the displacement of the acoustic sensor chip decreases with the increase of Young’s modulus of anti-chock rubber being loaded with either transient force or static force at the bottom of the combination of rubber and acoustic sensor chip.For the first time an anti-shock packaging model of an acoustic-vibration sensor system has been designed by using the shocking isolation principle. The finite element analysis has been applied for design and simulation of the model. The effects of Young’s modulus of anti-shock rubber on naturally occurring frequencies of the combination of rubber and an acoustic sensor chip were analyzed. The displacement of the acoustic sensor chip is loaded with force. The results of static analysis and harmonic analysis show that while increasing Young’s modulus of anti-chock rubber, the first five natural frequencies of the package body also increases. Yet the displacement of the acoustic sensor chip around the resonant frequency decreases. The results of static and transient analysis show that the displacement of the acoustic sensor chip decreases with the increase of Young’s modulus of anti-chock rubber being loaded with either transient force or static force at the bottom of the combination of rubber and acoustic sensor chip.

关 键 词：sensor packaging shock isolation anti-shock rubber finite element analysis 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]