无铅软钎料国内外的研究动态与发展趋势  

Research and development trend of lead-free solder alloy at home and abroad

作　　者：胡志田[1] 何前进[1] 徐道荣[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《焊接技术》2005年第3期4-7,共4页Welding Technology

摘　　要：全球禁铅运动的发展使得无铅技术已提上各国议事日程,针对这一形势,笔者概述了近几年来国内外无铅焊接的研究动态与发展趋势,特别介绍了无铅钎焊的软钎料开发的最新研究成果,并指出了该领域中值得关注的Sn-Ag与Sn-Zn系钎料的开发价值与应用前景,同时指出添加微量合金和稀土元素对无铅软钎料开发的意义。国内应重视这一领域的研究,争取在该领域的主动地位。With the prohibition of using lead solder, the lead-free technology has been put on the agenda in many nations. The paper summarizes the recent research and development trend of this field at home and abroad , especially the last results of lead-free solders. Attention should be paid to the research and application of Sn-Zn and Sn-Ag based solders, and the value of adding microalloy and rare-earth elements to the lead-free solders as well.

关 键 词：无铅软钎料 Sn—Ag SN-ZN 稀土 

分 类 号：TG425.1[金属学及工艺—焊接]