无铅软钎料的研究现状与展望  

Current Status & Prospect Of Lead-Free Solder Alloy

作　　者：胡志田[1] 徐道荣[1] 

机构地区：[1]合肥工业大学,安徽合肥230009

出　　处：《电子工艺技术》2005年第3期125-128,133,共5页Electronics Process Technology

摘　　要：随着国际上禁止含铅钎料使用日期的临近,无铅软钎料的研究开发与推广应用已迫在眉睫。综述了近年来国内外在无铅软钎料领域的研究开发情况,着重介绍了近一两年来的研究成果及应用情况,并指出目前国内对于该领域最值得关注的Sn-Zn与Sn-Ag两个系列无铅钎料的研究相对滞后,应当加快这方面的研究开发与实用化的步伐,争取早日赶上国际水平。With the advent of forbiding using lead solder,the research and exploitation of lead-free solders alloy is urgent.Summarise the research and development of this field in home and broad during recent years, especially the research fruits and application in the last two years, and points out that we should pay attention to the lag of the reseach in Sn-Zn and Sn-Ag based solders in home, so we must quicken the step of application and exploitation of lead-free solders so that we can catch up with the international level.

关 键 词：无铅软钎料 研究现状 展望 

分 类 号：TG425[金属学及工艺—焊接]