无铅化SMT质量检测技术  

Inspection Technology Of SMT Product Quality For Lead-Free Assembly

作　　者：史建卫[1] 何鹏[1] 钱乙余[1] 袁和平 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点试验室,黑龙江哈尔滨150001 [2]日东电子科技(深圳)有限公司,广东深圳518103

出　　处：《电子工艺技术》2005年第3期140-146,共7页Electronics Process Technology

摘　　要：针对人工目检、自动光学检测(AOI)、在线电路检测(ICT)和X射线检测等SMT质量检测技术,详细论述了其无铅化、微小化后的使用以及相应的改进方法。分析表明,在实际SMT产品质量检测中,应根据不同应用方面、检测技术的优缺点和发现缺陷的能力,进行合理选择与有机组合,通过互补性测试覆盖全部产品范围,把产品缺陷降到最低程度。在保证产品质量的过程中,检测技术与分析和建模工具FMEA、成品率预测建模工具一起使用,可保证产品质量,充分利用资源并减少测试时间。Illustrate the advantages and disadvantages of major inspection technology simply and give some improvement methods correspondingly.The result shows that inspection technology should be selected and combined in terms of measurement capability of inspection technology in applications.Production defects ratio will be lessened to minimal level by mutual assistant methods that cover full production defects.Considering product quality, combination of measurement methods should be connected with tools,FMEA-analyzing and building model,and finished production ratio prediction model.The optimized recipe can be got, ensuring production quality and making a good use of resource and reducing inspection times.

关 键 词：表面贴装 无铅化组装 在线电路检测 自动光学检测 X射线检测 

分 类 号：TN6[电子电信—电路与系统]