Cu(Ⅱ)在巯基化壳聚糖修饰金电极的循环伏安行为(Ι)  被引量:2

Cyclic Voltammogram Behavior of Cu(Ⅱ) on the Surface of Chemical Covalent Bonded Au Electrode Modified with CTS-SH

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作  者:杨声[1] 冯小强[1] 蒋罗明[1] 

机构地区:[1]天水师范学院生命科学与化学学院,甘肃天水741001

出  处:《天水师范学院学报》2005年第2期39-41,共3页Journal of Tianshui Normal University

摘  要:研究了Cu(Ⅱ)在巯基化壳聚糖(CTS-SH)共价键合修饰的金电极上的循环伏安行为。研究表明,在pH=4.9的磷酸盐体系中,离子的氧化还原过程为一准可逆过程,且Cu(Ⅱ)在0.28V处出现一氧化峰,在0.20V处出现一还原峰。The paper introduces the applications of chitosan in the electrol chemistry .It was applied in Au electrode modified with CTS-SH, a better electric current response would obtained in cyclic voltammetry. The cyclic voltammetry behavior of Cu(Ⅱ) on the surface of chemical covalence bonded Auelectrode modified with CTS-SH has been studied in this paper.As the experiment did,the reducing-oxido courseof Cu(Ⅱ) ion is a quasi-reversible one in 0.039mol/L(pH=4.9)NaH2PO4.The experiment has also been witnessed that the oxido peak of Cu(Ⅱ) is at 0.20V and the reducing peak is at 0.28V.

关 键 词:硫代乙醇酸 脱乙酰壳聚糖 修饰电极 循环伏安行为 Cu(Ⅱ) 共价键 

分 类 号:O646.54[理学—物理化学]

 

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