基于最大熵原理的平面研抛工艺参数优化  

Optimization of Plane Polishing Parameters Based on Maximum Entropy Principle

作　　者：周旭升[1] 李圣怡[1] 郑子文[1] 

机构地区：[1]国防科学技术大学,长沙410073

出　　处：《中国机械工程》2005年第11期1001-1004,共4页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(50375155)

摘　　要：提高光学零件研抛加工精度的关键是优选工艺参数。对此提出一种基于最大熵原理的平面研抛工艺参数优化方法。建立了工件研抛信息熵的数学表达式并给出了相关的物理解释,并对定偏心平面研抛工艺参数优选进行了数值模拟计算。研究结果表明,在定偏心平面研抛中,选择工件与研抛盘同方向等速转动可以使工件表面材料去除均匀,选择较大的偏心率可以提高加工效率,同时应实时修整研抛盘以减小研抛盘磨损对工件加工精度的影响。Selecting processing parameters is the key to increase polishing accuracy of optical elements. A method based on maximum entropy principle was presented to optimize processing parameters in plane polishing. The mathematic expression and corresponding physical explanations of the polishing entropy were established. Moreover, the processing parameters in eccentric plane polishing were calculated. The results show that in eccentric plane polishing the same rotational speed of workpiece and polishing table should be selected to remove material equably, and that a rather large eccentricity ratio should be selected to increase polishing efficiency. To reduce the influence of the wear on polishing accuracy, the polishing table should be trimmed on real time.

关 键 词：最大熵原理 平面研抛 材料去除 运动熵 

分 类 号：TH161[机械工程—机械制造及自动化] TG580.692[金属学及工艺—金属切削加工及机床]