环氧化硅油改性邻甲酚醛环氧树脂的研究  

Study of Epoxy Polysiloxane Modified O-cresol Formaldehyde Epoxy Resins

作　　者：姚海松[1] 刘伟区[1] 侯孟华[1] 申德妍[1] 

机构地区：[1]中国科学院广州化学研究所

出　　处：《中国塑料》2005年第5期29-33,共5页China Plastics

基　　金：广东省电子聚合物重点实验室基金资助项目(2004DG09)

摘　　要：采用侧基环氧化硅油(ES)及其改性物(PSA)改性邻甲酚醛环氧树脂(ECN),制备出一系列可用于电子封装等具有高韧性高耐热性的环氧基料。通过对固化物的冲击强度、拉伸强度、断裂伸长率和玻璃化转变温度(Tg)以及断裂面形态的测定,探讨了改性方法、有机硅组成与含量等对改性材料性能的影响。结果表明,用有机硅改性ECN后,其韧性和耐热性均有不同程度的提高,且环氧值高的ES和PSA的改性效果较好。其中环氧树脂经10份(质量份数,下同)ES-16或10份PSA-16改性后,韧性和耐热性均提高,符合电子封装等材料的改性要求,后者的耐热效果更为显著,Tg达183.46℃,比未改性环氧树脂提高了近20℃。O-cresol formaldehyde epoxy resins (ECN) were modified by lateral epoxy polysiloxane (ES) and its modifying agent (PSA), and a series of epoxy-based electronic packaging resins were prepared. The impact strength, tensile strength, elongation at break, glass transition termperature (T_g) and the morphology of fracture surfaces of the resins were studied. The introduction of ES or PSA improved the toughness and thermal behavior of the epoxy resins. When the content of PSA was 10 phr,a high T_g value of (183 ) was achieved.

关 键 词：环氧化硅油 有机硅 邻甲酚醛环氧树脂 改性 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]