SIS热熔压敏胶粘剂的研制  

Study on SIS hot melt pressure sensitive adhesive

作　　者：亢海刚[1] 张巧莲[1] 陈贤军[1] 

机构地区：[1]中国地质大学材料科学与化学工程学院,湖北武汉430074

出　　处：《粘接》2005年第3期27-29,共3页Adhesion

摘　　要：以SIS为主体原料,配合增粘树脂、增塑剂、防老剂等研制出SIS热熔压敏胶。通过实验对反应温度、反应时间、搅拌速度等工艺条件进行了优化;选择了合适的增塑剂、增粘树脂、软化剂、防老剂及填料,确定了胶粘剂的基本配方;讨论了各组分用量对粘接性能的影响,确定了其最适宜用量;通过正交优化设计,优化了SIS热熔压敏胶的配方,得出了包装用热熔压敏胶的最佳配方。Using styrene-isoprene block copolymer(SIS)as the base material and some auxiliary additives,the SIS-based hot melt pressure sensitive adhesive(HMPSA)was prepared.Through optimizing of process conditions,such as temperature,reaction time and stir speed etc.,the suitable plasticizer,tackifying resin,softening agent,antioxidant and filler etc.and the basic adhesive formulation were determined.The effect of the contents of the components was discussed and their optimal contents were taken.Using orthogonal experiments to optimize the SIS-based HMPSA the optimum HMPSA formulation forpackaging was obtained.

关 键 词：SIS 热熔压敏胶 180°剥离强度 正交实验 包装 

分 类 号：TQ436.3[化学工程]