Ar-Kr低温界面传热过程分子动力学模拟  

The molecular dynamics simulation of heat transfer process between Ar and Kr

作　　者：陈进[1] 徐征[2] 王惠龄[1] 

机构地区：[1]华中科技大学制冷与低温工程研究所,430074 [2]武汉理工大学自动化学院,430070

出　　处：《低温工程》2005年第3期45-47,共3页Cryogenics

基　　金：国家自然科学基金(51076013)资助项目资助

摘　　要：运用非平衡分子动力学原理和LJ势函数仿真研究氩(Ar)与氪(Kr)之间的界面层传热问题,模拟其界面传热的能量变化过程。仿真结果表明,即使界面粗糙度为0,低温固体界面热阻仍然存在。平均温度为40K,粗糙度为0时,氩(Ar)与氪(Kr)之间界面热阻为0.15～0.18Wm2/K,相对误差小于17%。Using non-equilibriam molecular dynamics and Lennard-Jones potential,the simulation of the process of the interface heat transfer between Ar and Kr at low temperature was studied.The resalts show that the interface thermal resistance between solids exists at cryogenic conditions even if the surface roughness of solids equals zero. When the average temperature is 40 K and the roughnees equals zero,the interface thermal resistance between Ar and Kr equals 0.15~0.18 Wm2/K and the error is less than 17%.

关 键 词：低温传热 界面热阻 分子动力学仿真 

分 类 号：TB611[一般工业技术—制冷工程]