低熔高强陶瓷结合剂的研究  

STUDY ON LOW MELTING POINT AND HIGH STRENGTH VITRIFIED BOND

作　　者：郭志敏[1] 张向红[1] 臧建英[2] 王艳辉[2] 

机构地区：[1]河北建材职业技术学院,河北秦皇岛066004 [2]燕山大学,河北秦皇岛066004

出　　处：《超硬材料工程》2005年第2期7-9,共3页Superhard Material Engineering

摘　　要：为实现陶瓷结合剂超硬磨具的低温烧结,减少或避免高温或由高温引起的对磨粒的伤害,本试验以黏土、硼玻璃和铅玻璃为主要原料,研制一种低熔点高强度结合剂。通过一系列试验,测定了结合剂的耐火度,研究了结合剂在高温下的相态,分析了结合剂在高温时与超硬磨粒的浸润性,并测试了结合剂的抗折强度。试验表明,该结合剂耐火度低、强度高,与超硬磨粒具有良好的浸润性,在高温下呈玻璃态,是一种低熔点高强度陶瓷结合剂。Low melting point and high strength vitrified bond is prepared to realize sintering of vitrified bond superhard grinding tools at lower temperature. Raw materials were mainly clay, boric glass and lead glass. The refractory temperature, the phase at high temperature, the bending strength of the bond and soakage between the bond and superhard grains were tested. The results just show that the bond exist as glassy phase and is a low melting point and high strength vitrified bond.

关 键 词：超硬磨具 陶瓷结合剂 低温烧结试验 低熔高强 玻璃态 

分 类 号：TQ437[化学工程]