钢铁基体上碱性无氰镀铜  

Non-cyanide alkaline copper plating process on steel matrix

作　　者：王瑞祥 

机构地区：[1]武汉风帆表面工程有限公司,武汉430013

出　　处：《电镀与涂饰》2005年第7期13-15,共3页Electroplating & Finishing

摘　　要：给出了一种钢铁基体上碱性无氰镀铜的工艺配方。介绍了镀液的配制方法和稳定性,并将本工艺与氰化镀铜工艺的深镀能力进行了比较。测试了电流效率、镀层的受热性和结合力。提出了工艺流程中需要注意的问题。结果表明,本工艺的深镀能力优于氰化镀铜工艺,得到的镀层经烘烤和弯曲试验均无脱皮、起泡现象,镀层与基体结合良好。A technical formulation of non-cyanide alkaline copper plating process on steel matrix was given. The preparation method and stability of the plating bath were introduced. The throwing power of the process was compared with that of cyanide copper plating, and the current efficiency, the thermostability and adhesion of the deposit were tested. The problems during plating were pointed out. The results prove that the throwing power of the process is better than that of cyanic copper plating, and the deposits have no peeling and blistering after baking and bending tests and have good adhesion to the matrix.

关 键 词：钢铁基体 无氰碱性镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]