不粘薄膜的微/纳米结构及其机理研究  

Micro/Nano-Structure and Mechanism of Anti-Sticky Thin Film on Copper Substrate

作　　者：陈志[1] 耿兴国[1] 

机构地区：[1]西北工业大学理学院,陕西西安710072

出　　处：《材料保护》2005年第7期1-4,共4页Materials Protection

基　　金：航天支撑技术基金资助项目(2004CH110002);陕西省自然基金资助项目(2002B25)

摘　　要：拟通过化学腐蚀方法在铜基底上制备出高性能的不粘薄膜。具体为首先将分析纯HCl、HNO3、HF按体积比1551混合,配制成腐蚀液对铜片进行腐蚀,构建出具有类荷叶表面的微/纳米结构,接着用按体积比1%配制好的氟硅烷溶液对该基片进行修饰,经风干后就制备出了具有超疏性能的不粘薄膜。试验中用接触角测量仪测得改性前清洁的铜基片对水、蓖麻油和丁羟胶的接触角分别为80°,25°和50°;相比而言,改性后的铜片对以上液滴的接触角分别为153°,137°和142°,用CB方程计算出改性后铜片表面细微结构中与液滴接触的空气膜所占的比例约为0.93。试验证明,不粘薄膜的超疏性能的实现是由微/纳米精细结构和低表面能的氟硅烷薄膜共同决定的。High-performance anti-sticking film was prepared on copper substrate using chemical corrosion method. Thus the mixture of analytically pure HCl, HNO_3 and HF at a certain volume fraction was used as the corrosive liquid to corrode the copper substrate so that a lotus-leaf-like micro-and nano-structure was formed thereon. Then the aqueous solution of 1% fluoroalkyl silane was used to modify the corroded copper surface to allow the generation of the anti-sticking film of super repellence to water and oil after drying in air. The contact angles of water, caster oil, and HTPB on the unmodified copper surface were measured to be 80°, 25°and 50°, respectively; while that on the modified copper surface were 153°, 137°and 142°. The ratio of the air contacting with the liquid droplet in the fine structure of the modified copper surface was calculated to be about 0.93% using the CB equation. The excellent repellence to water and oil of the fluoroalkyl silane anti sticking film was attributed to its micro/nano-structure and low surface energy.

关 键 词：薄膜 铜材 氟硅烷 微/纳米结构 接触角 表面自由能 

分 类 号：TG174.1[金属学及工艺—金属表面处理]