可靠性增长模型和正交缺陷分类的结合及在过程定性分析中的应用  

Combination of Reliability Growth Model and Orthogonal Defect Classification and Application to Qualitative Analysis of Process

作　　者：陈莉[1] 刘海红[1] 盛昌[1] 陈威[1] 

机构地区：[1]湖南大学软件学院,长沙410082

出　　处：《科学技术与工程》2005年第14期963-966,共4页Science Technology and Engineering

摘　　要：软件过程的度量和分析是近年来软件工程领域的重要研究方向。传统可靠性增长曲线模型可对软件过程进行预警,正交缺陷分类方法可对软件缺陷进行度量,但是两种方法都无法对软件过程提供直接的指导和定性的分析。提出将传统可靠性增长曲线模型结合正交缺陷分类属性缺陷类型,将不同种类的缺陷放在同一横坐标上进行比较,得出软件过程定性分析结论。Software process measurement and analysis are an important research aspect in the field of software engineering. Traditional reliability growth models can present signal alerts and orthogonal defect classification method can measure the software defects but both cannot provide guidance directly for the software process. The reliability growth model combines with different defect type of ODC and projecting them on a common abscissa to make qualitative inferences.

关 键 词：增长模型 正交缺陷分类 缺陷类型 软件可靠性 软件过程度量 

分 类 号：TP311.11[自动化与计算机技术—计算机软件与理论]