二乙烯基硅氧烷-双苯并环丁烯树脂的制备与性能研究  

STUDY ON SYNTHESIS AND PROPERTIES OF DIVINYL TETRAMETHYL DISILOXANE-BISBENZOCYCLOBUTENE RESIN

作　　者：朱国敏[1] 沈学宁[1] 王靖[1] 黄发荣[1] 

机构地区：[1]华东理工大学材料科学与工程学院超细材料制备与应用教育部重点实验室,上海200237

出　　处：《玻璃钢／复合材料》2005年第4期16-19,共4页Fiber Reinforced Plastics/Composites

摘　　要：苯并环丁烯树脂在许多高科技领域都有应用,是当今高性能树脂研究的热点之一。本文采用Heck反应合成了二乙烯基硅氧烷-双苯并环丁烯树脂,并用红外、质谱、核磁共振对其结构进行了表征,研究了该树脂的固化反应,最后测定了固化树脂的物理性能。研究结果表明,二乙烯基硅氧烷-双苯并环丁烯固化树脂具有优异的热稳定性能和介电性能。Benzocyclobutene resin, which is one of high performance resins, has found applications in high-tech fields. Divinyl tetramethyl disiloxane-bisbenzocyclobutene is synthesized by Heck reaction and characterized by FT-IR, ~1H NMR and MS. The kinetics of curing reaction of DVS-bis-BCB is investigated. Furthermore, the properties of the cured resin are measured. The thermal decomposition temperature arrives to 452.7℃. The dielectric constant of the cured resin and the tangent of the dielectric loss are 2.37 and 2.32×10^-3 at 1MHz respectively.

关 键 词：苯并环丁烯 二乙烯基硅氧烷树脂 HECK反应 固化 

分 类 号：O631.6[理学—高分子化学]