CuSiAlTi钎料对SiC陶瓷的润湿性  

Wettability of CuSiAlTi Brazing Alloy on SiC Ceramics

作　　者：吕宏[1] 康志君[1] 张小勇[1] 楚建新[1] 王林山[1] 

机构地区：[1]北京有色金属研究总院,北京100088

出　　处：《稀有金属材料与工程》2005年第7期1106-1108,共3页Rare Metal Materials and Engineering

基　　金：国家自然科学基金资助(18392911)

摘　　要：研究了CuSiAlTi钎料对SiC陶瓷的润湿性。发现元素Ti显著影响钎料对SiC陶瓷的润湿性。采用SEM,XRD对润湿界面进行了观察分析,发现在界面上存在1个含TiC的很薄的界面层和含Cu较多、含Ti元素较少的较厚的界面过渡层。分析表明,在润湿过程中钎料中的元素与SiC陶瓷中的Si,C相互扩散,Cu元素在SiC陶瓷一侧是主要的扩散元素,Cu的扩散在SiC陶瓷一侧形成了较厚的扩散层。To study SiC and other material joining, the wettability of Cu-Al-Si-Ti brazing alloys on silicon carbide was investigated by sessile drop method. It was found that the Ti content and the wetting temperature affected greatly the contact angle. The interface of brazing alloys/silicon carbide was observed and analysed by SEM and XRD. The result indicated that the interface consisted of two layers, e.g. one of them was a thin interface layer with TiC, the other was a thick interface transition layer with Cu-more content and Ti-less content. The diffusion of element Cu determines the property of transition layer. This kind of brazing alloy is a good candidate for the high temperature brazing silicon carbide.

关 键 词：Cu基钎料 SIC陶瓷 润湿 钎焊 

分 类 号：TQ174[化学工程—陶瓷工业]