全焊接球阀生产中平板对焊试验温度场的计算  

Calculation of Welded Test Temperature Field to Flat Board During Production of Full Welded Ball Valve

作　　者：朱政强[1] 陈立功[1] 汪建华[1] 倪纯珍[1] 

机构地区：[1]上海交通大学焊接研究所,上海200030

出　　处：《焊管》2005年第4期9-11,共3页Welded Pipe and Tube

摘　　要：针对全焊接球阀生产中的温度控制这一关键问题,对平板对焊试验温度场进行了计算,分析了空冷和加紫铜散热条两种情况下的温度场分布后发现:按照所提供的焊接参数和层间温度进行计算,密封圈部位的温度满足设计要求,不需要使用紫铜散热条。Faced to the only key problem-temperature control during manufacturing of full welded ball valve, to calculate the flat board to welding test temperature field and after analyzing the temperature field distribution under two circumstances of air cooling and add copper radiating bars and detect that to calculate in accordance with welding parameter and layer temperature provided and the temperature of seal part meet design requirement and no need to use copper radiating bars.

关 键 词：全焊接球阀 温度场 平板焊接 

分 类 号：TG407[金属学及工艺—焊接]