Cu-Ni-Si合金的时效强化机制分析  

Analysis of Strenghening Mechanism of Cu-Ni-Si Alloy During Aging

作　　者：王东锋[1] 杨萍[1] 孔立堵[1] 康布熙[2] 刘平[2] 

机构地区：[1]空军第一航空学院二系,河南信阳464000 [2]河南科技大学材料科学与工程学院,河南洛阳471003

出　　处：《热加工工艺》2005年第7期31-33,共3页Hot Working Technology

基　　金：国家自然基金资助项目(50071026)

摘　　要：分析了Cu-3.2Ni-0.75Si-0.30Zn合金在时效过程中显微硬度的变化规律。结果表明,合金在500℃时效时可以获得最大显微硬度,而550℃时效时可以获得最高导电率。分析表明,该合金的强化效果主要取决于析出第二相体积分数以及第二相颗粒半径;第二相体积分数接近平衡态以前,第二相的析出对强化效果起主要作用;而体积分数接近平衡态以后,第二相颗粒的长大则成为导致强化效果降低的主要因素。The varying regularity of microhardness of Cu-3.2Ni-0.75Si alloy was analysed during aging. Results show that the alloy can obtain maximum microhardness when aging at 500℃, while electric conductivity can reach the highest value when aging at 550℃. Anlysis show that, the strengthening effect of the alloy lean mainly upon the volume fraction and radius of second phase. Before volume fraction reach equilibrium, the precipitation of second phase has important influence on strenghening of the alloy , while after equilibrium, the main factor that leads to decrease of strenghening effect is the growth of second phase.

关 键 词：Cu—Ni—Si合金 时效 显微硬度 导电率 

分 类 号：TG166.2[金属学及工艺—热处理]