Nb、Cu金属层厚度对Si_3N_4/Nb/Cu/Ni/Incone l600接头组织和性能的影响  

Effect of Nb and Cu metal layer thickness on microstructure and property of Si_3N_4/Nb/Cu/Ni/Inconel600 joint

作　　者：杨敏[1] 邹增大[1] 曲士尧[1] 王育福[1] 

机构地区：[1]山东大学材料科学与工程学院,济南250061

出　　处：《焊接学报》2005年第7期54-58,共5页Transactions of The China Welding Institution

基　　金：山东省自然科学基金资助项目(Z2002F03)

摘　　要：采用Nb/Cu/N i作中间层,在连接温度为1 403 K、连接时间为50 m in、连接压力为7.5MPa的条件下,采用不同尺寸的中间层进行了S i3N4陶瓷与Inconel 600高温合金的部分液相扩散连接。通过改变Nb层、Cu层厚度,研究了Cu层、Nb层厚度变化对S i3N4/Nb/Cu/N i/Inconel 600接头的组织和性能的影响。研究发现,当Cu层厚度小于0.05 mm时,随着Cu层厚度的增加,接头中的Cu-N i合金层厚度增加,接头强度快速增加;当Cu层厚度超过0.05 mm时,接头中的Cu-N i合金层厚度由于压力的作用不明显增加,接头强度增加缓慢。随着Nb层厚度的增加,反应层厚度增加,接头的强度先增大后减小。Partial liquid phase diffusion bonding (PLPDB) of Si3N4 to Inconel600 high temperature alloy was carried out by using the interlayer of Nb/Cu/Ni foil. The main processing factors had been highlighted for the strength of Si3N4/Nb/Cu/Ni/Inconel600 system. Optimum parameters had been obtained as bonding temperature 1403 K, bonding time 50 min and bonding pressure 7.5 MPa. Effects of Cu and Nb metal layer on the microstructure and properties of joint were respectively investigated by changed thickness of Nb and Cu layer. Test results showed that while the thickness of Cu layer was thinner than 0.05 mm, the strength of joint increased fast with the increase of Cu layer thickness; but when the thickness surpassed 0.05 mm, the strength of joint increased slowly with the increase of Cu layer. When the thickness of Nb layer increased, the thickness of reaction layer increased, but the strength of Si3N4/Nb/Cu/Ni/Inconel600 joint increased firstly to a maximum value, then decreased.

关 键 词：部分液相扩散连接 SI3N4陶瓷 INCONEL 600高温合金 中间层 

分 类 号：TG454[金属学及工艺—焊接]