结晶器铜板热裂纹原因及对策  

Reasons for Thermal Crack in Mold Copper Plate And the Countermeasures

作　　者：王隆寿 

出　　处：《宝钢技术》1995年第1期20-27,共8页Baosteel Technology

摘　　要：连铸结晶器铜板产生热裂纹的直接原因在于钢板表面温度过高，主要由铜板冷却结构设计存在问题、冷却水质较差、操作条件苛刻、维修周期较长及铜板材质和表面处理方法需改进等众多因素所造成。在采取相应的若干措施后，铜板因异常热裂纹而返修的比例从原来的６０％下降到８％以下。The direct reasons responsible for the thermal crack in mold copper plate is the excessively high surface temperature which results from the combined effects of unsuccessful cooling structure design, poor quality of cooling water, severe operating conditions, the improperly long period of maintenance, the bad material of copper plate, and the unimproved surface treatment. Having taken some related measures, the repair rate of copper plate due to thermal crack has been reduced from 60% down to 8% and under

关 键 词：结晶器 铜板 热裂纹 表面温度 连续铸钢设备 

分 类 号：TF341.6[冶金工程—冶金机械及自动化]