半导体桥火工品的发展  

The Development of Semiconductor Bridge Initiating Explosive Device

作　　者：刘西广[1] 徐振相[1] 宋敬埔[1] 周彬[1] 秦志春[1] 王成[1] 杜其学 

机构地区：[1]南京理工大学

出　　处：《爆破器材》1995年第4期12-17,共6页Explosive Materials

摘　　要：文中系统评价和分析了近年来国内外半导体桥结构、制造工艺和封装技术，展望了半导体桥点火装置及智能火工装置的应用前景，揭示了这类火工品必将得到广泛应用的趋势．In this paper, the structuUe, processing and pekaging technology of semiconductor bridge (SCB) in recant years have adn appraised and analysed systematitally. The application prospect of SCB ignitor and intelligent initationg explosive device has ben forecasted. The tendencyto use this kind of initiatingexplosive device widely has been revtaled.

关 键 词：发火桥 火工品 半导体桥 进展 制造工艺 

分 类 号：TQ567.9[化学工程—炸药化工]