磷对化学沉积Ni－P非晶态镀层晶化过程的影响  

Effects of Phosphorus on Crystallization of Amorphous Electroless Ni-P Deposit

作　　者：朱勋[1] 靳新位[1] 赵保军 刁美艳[1] 李立丹 

机构地区：[1]河北机电学院

出　　处：《电镀与涂饰》1995年第4期26-29,共4页Electroplating & Finishing

摘　　要：通过示差扫描热分析（ＤＳＣ）、Ｘ射线衍射（ＸＲＤ）和硬度测试研究了不同磷含量的Ｍ－Ｐ合金镀层的晶化过程。结果表明，随着镀层晶化的进行，硬度提高。当热处理温度达４２０℃时，镀层全部转化为晶态结构，主要为弥散分布的Ｎｉ３Ｐ产相，硬度大到峰值，高磷镀层的硬度高于低磷镀层。但在镀态，则低磷镀层的硬度高于高磷镀层。Crystallization of electroless Ni-P deposits were studied through differential scanning calorimetry(DSC), X-ray diffraction analysis and hardness testing. The deposit hardness increases with the proceeding of crystallization. After heat treatment at a temperatrue of 420℃,the deposit structure changes from amorphous to crystalline one in which mainly Ni3P phase diffused and the deposit hardness increases to a peak value. Deposits with higher phosphorus content show higher hardness when heat-treated but lower hardness when as-plated.

关 键 词：化学镀 镍磷合金 磷 含量 晶化 镀合金 

分 类 号：TQ153.2[化学工程—电化学工业]