微包覆铜贮氢合金电极的研究  

Study of copper-microencapsulated hydrogen-storage alloy electrode

作　　者：文振环[1] 李国勋[1] 黄爱琴[1] 乔欢[1] 马淑兰[1] 沈剑韵[1] 

机构地区：[1]北京有色金属研究总院冶金物化和材料设计研究中心

出　　处：《电源技术》1995年第3期24-27,共4页Chinese Journal of Power Sources

摘　　要：对比研究了表面微包覆铜与未包覆的AB_5型混合稀土贮氢合金电极的电性能.实验结果表明,表面微包覆铜贮氢电极在放电容量、高倍率放电、自放电和循环寿命性能方面均有明显改进.化学镀铜微包覆处理的操作工艺简便,费用低廉.The electrode characteristics of hydrogen-storage alloy Mm(NiCoMnAl)5 with and without copper-microencapsulation were comparatively investigated. The results show that the copper-microencapsulated hydrogen-storage alloy electrode has better performances in capacity, high-rate discharge, self-discharge and cycle life. The method of chemical plating we adopted is easy and inexpensive for the copper-microencapsulating.

关 键 词：贮氢合金 电池 微包覆铜电极 

分 类 号：TM241[一般工业技术—材料科学与工程] TM910.3[电气工程—电工理论与新技术]