老炼过程中CuCr系触头表层组织形成的特点  

Surface Microstructure Features of CuCr Contacts After Conditioning

作　　者：杨志懋[1] 严群[1] 丁秉钧[1] 王笑天[1] 

机构地区：[1]西安交通大学,710049

出　　处：《高压电器》1995年第3期21-24,共4页High Voltage Apparatus

基　　金：国家自然科学基金资助项目

摘　　要：研究了CuCr和CuCrWC真空触头合金老炼过程中表层组织形成的特点。研究表明老炼过程主要造成合金表面熔化层组织细化和成分均匀化,从而使耐电压强度升高。在CuCr合金加入WC可以提高其耐电压强度。本文还讨论了电流大小对电压老炼过程的影响。The surface microstructure of CuCr and CuCrWC contact alloys af-ter conditioning is investigated. Experimental results show that the conditioning process produces a small melt layer on the surface which has much fine microstruc-ture and more uniform microcompositions, then its dielectric strength increases. The addition of WC in CuCr alloy can increase its dielectric strength. The effect of current on conditioning process is also discussed in this paper.

关 键 词：老炼 铜合金 触头 绝缘强度 

分 类 号：TM503.5[电气工程—电器] TM241[一般工业技术—材料科学与工程]